| Chair |
Nick Koop, TTM Technologies |
| Chair |
Karl Sauter, High Density Packaging User Group International, Inc. |
| Vice Chair |
Mark Finstad, Flexible Circuit Technologies, Inc. |
| Staff Liaison |
Doug Sober |
| Committee Charter |
This committee provides a forum for the exchange of technical information and development of guidelines in the areas of: Fabrication processes control as well as Drilling and routing. This committee also provides a forum for the exchange of technical information and support of test methods, process standards and other technical documents relating to: Circuitization by subtractive and additive technologies; Electroplating and electroless plating; Direct metallization processes and interplane adhesion enhancement. |
